Ronghui Electronics (Huizhou) Co., Ltd.
Support
No. |
Project |
Ability |
1 |
Number of PCB layers |
1-12 |
2 |
Minimum wire diameter/line spacing (H/H OZ) |
3 mil (0076 mm) |
3 |
Minimum wire diameter/line spacing (1/1 OZ) |
3 mil (0.076mm) |
4 |
Minimum finished hole |
4 mil (0.1 mm) |
5 |
Layer and layer alignment |
±3 mil (±0.076 mm) |
6 |
Minimal anti-welding bridge |
3 mil (0.076 mm) |
7 |
Shape accuracy |
+/-4 mil (±0.1 mm) |
8 |
Aspect ratio |
10:1 |
9 |
Minimum plate thickness, maximum plate thickness |
8 mil (0.2 mm) 120mil(3.0mm) |
10 |
Surface treatment |
Lead-free spray tin, gold sink, tin, OSP, silver |