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Warpage in the manufacturing process

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Warpage in the manufacturing process

[Abstract]:
Warpage in the manufacturing process

Warpage in the manufacturing process

 

1. Engineering Design: Points to note when designing printed boards:

 

A. The arrangement of the interlayer prepregs should be symmetrical, for example, a six-layer plate, and the thickness between 1 to 2 and 5 to 6 layers and the number of prepreg sheets should be the same, otherwise, the warpage will easily occur after lamination.

 

B. Multilayer core boards and prepregs should use the same supplier's product.

 

C. The area of the circuit pattern on the A and B sides of the outer layer should be as close as possible. If the A side is a large copper surface and the B side only takes a few lines, the printed board can easily warp after etching. If the line areas on both sides differ too much, separate grids can be added on the thin side for balance.