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Multi-layer Circuit

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Multi-layer Circuit

Features :
4 layers + BGA + blind hole + Tg170 + 0.15mm hole
Board thickness: 1.2MM
Minimum aperture: 0.15mm
Aspect ratio: 7:1
Plug hole diameter: 0.3MM-0.4MM
Blind hole: L1-L4
Line width / spacing: 4mil/4mil
Surface treatment: OSP
Thickness of OSP: 0.2-0.3mil
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Ronghui Electronics (Huizhou) Co., Ltd.

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暂未实现,敬请期待
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