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Multi-layer Circuit

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Multi-layer Circuit

Features :
HDI 8 layer + BGA diameter 0.1mm + impedance + 3mil line
Surface treatment: OSP
Board thickness: 1.2MM
Minimum aperture: 0.15MM
Aspect ratio: 8:1 core
Board thickness: 0.1MM (without copper)
Plate type: FR-4
Line width: 3mil/3mil
The minimum green oil bridg
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Ronghui Electronics (Huizhou) Co., Ltd.

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暂未实现,敬请期待
暂未实现,敬请期待
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