Products

Multi-layer Circuit

Features :

HDI 8 layer + BGA diameter 0.1mm + impedance + 3mil line

Surface treatment: OSP
Board thickness: 1.2MM
Minimum aperture: 0.15MM
Aspect ratio: 8:1 core
Board thickness: 0.1MM (without copper)
Plate type: FR-4
Line width: 3mil/3mil
The minimum green oil bridg

Description

Ronghui Electronics (Huizhou) Co., Ltd.

Multi-layer Circuit