Products

Multi-layer Circuit

Features :

8-layer + impedance (12 groups) + Tg170 + BGA (8mil)

Surface treatment: Shen Jin
Board thickness: 1.6MM
Minimum aperture: 0.15MM
Aspect ratio: 10:1 sheet
Type: FR-4 KB-6167(Tg170)
Minimum line width/line spacing: 3.0mil/3.0mil

Description

Ronghui Electronics (Huizhou) Co., Ltd.

Multi-layer Circuit