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Multi-layer Circuit

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Multi-layer Circuit

Features :
8-layer + impedance (12 groups) + Tg170 + BGA (8mil)
Surface treatment: Shen Jin
Board thickness: 1.6MM
Minimum aperture: 0.15MM
Aspect ratio: 10:1 sheet
Type: FR-4 KB-6167(Tg170)
Minimum line width/line spacing: 3.0mil/3.0mil
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Ronghui Electronics (Huizhou) Co., Ltd.

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